Teledyne FLIR Boosts Boson+ Infrared Thermal Camera Performance with Embedded Software Upgrade

Enhanced LWIR thermal performance with leaing SWaP provides low-risk integration for unmanned platforms, security applications, handhelds, wearables, and thermal sights

GOLETA, Calif., July 17, 2024 ― Teledyne FLIR, part of Teledyne Technologies Incorporated, today announced the next-generation embedded software fo

r the ITAR-free Boson+ thermal camera module, delivering high performing uncooled thermal imaging technology for defense, firefighting, automotive, security, and surveillance applications.

Featuring industry-leading thermal sensitivity of ≤20 mK, Boson+ has been upgraded to provide even sharper thermal imagery and improved spatial filtering. Continuously improved thermal performance and proven market-leading reliability make Boson+ the low-risk integration choice for unmanned platforms, security applications, handhelds, wearables, and thermal sights.

“Boson+ shares the industry-leading size, weight, and power (SWaP) of the widely deployed and real-world-proven Boson thermal camera module, simplifying integration and shortening time to market for our customers,” said Dan Walker, vice president, product management, OEM cores, Teledyne FLIR. “With software updates including new color palettes, low gain mode, and an updated GUI, the AI-ready Boson+ continues to be the go-to thermal module for defense, industrial, and commercial integrators.”

New Emberglow Palette (pictured left) and Aurora Palette (pictured right).

Boson+ interfaces seamlessly with the new Teledyne FLIR AVP, an advanced video processor that powers Prism™ AI and computational imaging at the edge. The AVP, built on the latest Qualcomm QCS8550, efficiently runs Teledyne FLIR Prism AI software providing detection, classification, and target tracking. To improve data fidelity and enhance decision support, it also operates Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction.

Made in the USA, the 12-micron pixel pitch Boson+ is available in both 320 x 256 and 640 x 512 resolutions. The noise equivalent differential temperature (NEDT) of 20 mK or less offers significantly enhanced detection, recognition, and identification (DRI) performance. Improved video latency enhances tracking, seeker performance, and decision support.

Boson+ LWIR Product Family.

Truly designed for integrators, the Boson+ is available with a variety of lens options, comprehensive product documentation, an easy-to-use SDK, and a user-friendly GUI. Customers have access to the US-based Teledyne FLIR Technical Services team to reduce development risk and cost. Boson+ is dual use (non-ITAR) and is classified under US Department of Commerce jurisdiction as EAR 6A003.b.4.a.

The Teledyne FLIR Boson+ is available for purchase globally from Teledyne FLIR and its authorized dealers. To learn more, visit www.flir.com/bosonplus.

About Teledyne FLIR 

Teledyne FLIR, a Teledyne Technologies company, is a world leader in intelligent sensing solutions for defense and industrial applications with approximately 4,000 employees worldwide. Founded in 1978, the company creates advanced technologies to help professionals make better, faster decisions that save lives and livelihoods. For more information, please visit www.teledyneflir.com or follow @flir.